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NTLUS3A40PZ
Power MOSFET
? 20 V, ? 9.4 A, m Cool t Single P ? Channel,
ESD, 2.0x2.0x0.55 mm UDFN Package
Features
? UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
? Low Profile UDFN 2.0x2.0x0.55 mm for Board Space Saving
? Lowest RDS(on) in 2.0x2.0 Package
? ESD Protected
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? High Side Load Switch
? PA Switch and Battery Switch
? Optimized for Power Management Applications for Portable
Products, such as Cell Phones, PMP, DSC, GPS, and others
V (BR)DSS
? 20 V
http://onsemi.com
MOSFET
R DS(on) MAX
29 m W @ ? 4.5 V
39 m W @ ? 2.5 V
60 m W @ ? 1.8 V
120 m W @ ? 1.5 V
S
I D MAX
? 9.4 A
G
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Symbol
Value
Units
Drain-to-Source Voltage
Gate-to-Source Voltage
V DSS
V GS
? 20
± 8.0
V
V
D
P ? Channel MOSFET
Continuous Drain
Current (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
? 6.4
? 4.6
A
MARKING
DIAGRAM
Power Dissipa-
tion (Note 1)
t ≤ 5s
Steady
State
T A = 25 ° C
T A = 25 ° C
P D
? 9.4
1.7
W
1
6
UDFN6
CASE 517BG
m COOL t
1
AA M G
G
Continuous Drain
Current (Note 2)
t ≤ 5s
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
I D
3.8
? 4.0
? 2.9
A
AA = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
Power Dissipation (Note 2)
Pulsed Drain Current
T A = 25 ° C
tp = 10 m s
P D
I DM
0.7
? 30
W
A
Operating Junction and Storage
Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
ESD Rating (HBM) per JESD22 ? A114F
T J ,
T STG
I S
T L
ESD
-55 to
150
? 1.0
260
>2000
° C
A
° C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm 2 , 2 oz. Cu.
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
July, 2011 ? Rev. 3
1
Publication Order Number:
NTLUS3A40PZ/D
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